ehwa diamond

CMP Pad Conditioners are used for dressing poly-urethane based CMP pads. EHWA produces pad conditioners by three methods. BSL (brazed single layer) Electroplated. NEW BSL type (double metal layer).

BSL products provide very fast removal rate as a result of the chemical bonding of the abrasive grit to a stainless steel body and the resuiting increased chip clearance. Electrolated products provide improved flatness and better surface finish.

The NEW BSL type has a double metal layer. The first layer provides excellent diamond retention and the second layer provides a clean surface that minimizes micro-scratches. The NEW BSL type conditioner combines the best features of both giving rapid stock remval while providing a clean surface that minimizes micro-scratches and provides improved flatness.

Classification	Abrasive bonding	Distinctive features
Brazed SingleLayer (BSL)	Chemical reaction	Chip pocket : good circutation of'slurry ..and'swarf. Excallent Diamond Bonding : prevents ..diamond pull out. *Diamond protrusion : good removal rate.
Electroplated	Mechanical tightening	Good flatness : minimize micro scratching. Good wear resistance : lesscontamination.
NEW BSL Type (Double Metal Layer)	Chemical + Mechanical bonding	Merits of Brazed Single Layer and ..electroplated product. Higher removal rate without micro- scratch.

Mahines (MODEL)	Polished materials	Available grit size
AMAT(Mirra) SpeedFam / IPEC (Auriga, CMP 200 / 300, Avantgaard 776, 876) Ebara (EPO-222 (H), 333) Strasbaugh (6DS-SP , 6ED) Lam (Teres. ect.	Oxide CMP : (BPSG, TEOS, PSG) Metal CMP : (AL, W, Cu) STI, PGI, Poly-Si CMP	#30 / 40 - #120 / 140 (Mash)