Over the past twenty years, the electrical, electronic, and semi-conductor industries of the world experienced significant growth and will continue to reach greater heights at even greater speeds.

These industries require ultra high precision and fine mirror-like finishes to manufacture their products. EHWA has focussed its resources and technology on these applications and provides a full range of quality, high value products to meet customer needs.


 
    Manufactured with selected diamond particles with a metal matrix matched to the application. Provides longer tool life and lower cost.
       
 
    Used to granding the edge of silicon wafers.
       
 
    Used for high precision cutting of electronic parts.
       
 
    Used for trimming of silicon wafers.
       
 
    CMP pad conditioners are used for dressing poly-urethane based CMP pads. EHWA produces pad conditioners by three methods: BSL(brazed single layer) electroplated, NEW BSL type (double metal layer).